Semiconductor package including image sensor and holder with transparent cover and adhesive stopper
US9640575B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 4, 2016 |
| Grant date | May 2, 2017 |
| Priority date | — |
| Expiry date | Apr 4, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
Abstract
A semiconductor package includes a substrate, an image sensor chip mounted on the substrate, a holder disposed on the substrate and surrounding the image sensor chip, and the holder has an inner surface facing the image sensor chip and an outer surface opposite to the inner surface. The semiconductor package further includes a transparent cover combined with the holder, and the transparent cover is spaced apart from and faces the substrate. The holder includes: a hole penetrating the holder from the inner surface to the outer surface. In addition, the semiconductor package further includes a first stopper disposed in the hole and a second stopper disposed at a position corresponding to the hole on the outer surface of the holder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.