Hansung Ryu
10Patents
3h-index
10Co-inventors
49Inventor score
Filing activity: Jan 10, 2014 → Mar 1, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10211070B2 | Semiconductor device and method for manufacturing the same | Electricity | 46 | Active |
| US9978694B2 | Semiconductor package and method of fabricating the same | Electricity | 8 | Active |
| US10347611B2 | Semiconductor packages having redistribution substrate | Electricity | 4 | Active |
| US10699915B2 | Semiconductor device and method for manufacturing the same | Electricity | 2 | Active |
| US9640575B2 | Semiconductor package including image sensor and holder with transparent cover and adhesive stopper | Electricity | 1 | Active |
| US10937771B2 | Semiconductor packages | Electricity | 0 | Active |
| US10937667B2 | Semiconductor device and method for manufacturing the same | Electricity | 0 | Active |
| US9324748B2 | Semiconductor package including an image sensor and a holder with stoppers | Electricity | 0 | Active |
| US11574819B2 | Semiconductor device and method for manufacturing the same | Electricity | 0 | Active |
| US12272610B2 | Semiconductor package with stiffener | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.