Booster antenna, contactless chip arrangement, antenna structure and chip arrangement

US9646242B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Guenter Hofer · St. Oswald, AT
• Gerald Holweg · Graz, AT
• Walther Pachler · Graz, AT

Key dates

• Filing date: Feb 28, 2014
• Grant date: May 9, 2017
• Expiry date: Feb 28, 2034

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01Q21/30
• WIPO field: Telecommunications
• WIPO sector: Electrical engineering

Abstract

In various embodiments, a booster antenna for a chip arrangement is provided. The booster antenna includes: a first circuit, which forms a first resonant circuit; a second circuit, which forms a second resonant circuit, wherein the first circuit is electrically conductively connected to the second circuit; and a third circuit, which forms a third resonant circuit, wherein the third circuit is electrically conductively connected to the second circuit.