Alignment systems and wafer bonding systems and methods
US9646860B2 · kind B2 · utility
12Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 9, 2013 |
| Grant date | May 9, 2017 |
| Priority date | — |
| Expiry date | Oct 11, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12042
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Alignment systems, and wafer bonding alignment systems and methods are disclosed. In some embodiments, an alignment system for a wafer bonding system includes means for monitoring an alignment of a first wafer and a second wafer, and means for adjusting a position of the second wafer. The alignment system includes means for feeding back a relative position of the first wafer and the second wafer to the means for adjusting the position of the second wafer before and during a bonding process for the first wafer and the second wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.