Method for fabricating and manufacturing micro—and nano-fabricated devices and systems securely
US9646878B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 19, 2014 |
| Grant date | May 9, 2017 |
| Priority date | — |
| Expiry date | Sep 6, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/038
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method is disclosed for manufacturing integrated circuits, microelectronics, micro-electro-mechanical systems (MEMS), nano-electro-mechanical systems (NEMS), photonic, and any micro- and nano-fabricated devices and systems designs that allow these designs to be kept secure. The manufacturing of the devices in the substrates is performed in a traditional manner at a foundry that can be located anywhere in the world., The manufacturing at this foundry is stopped just before the fabrication of the first layer of electrical interconnects. At this stage, the semiconductor substrates with the devices, minus electrical interconnects, are sent back to the design organization (or their designated trusted foundry) to perform the fabrication of the electrical interconnects to complete the entire manufacturing process. Since the electrical interconnection wiring diagram is the critical component of the design, this de-coupling of the manufacturing allows the designs of the devices and systems to be kept secure and confidential.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.