Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices
US9646923B2 · kind B2 · utility
8Cited by
142References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2012 |
| Grant date | May 9, 2017 |
| Priority date | — |
| Expiry date | Dec 18, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3841
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices are disclosed. In one embodiment, a semiconductor device includes a substrate and conductive traces disposed over the substrate. Each of the conductive traces has a bottom region proximate the substrate and a top region opposite the bottom region. The top region has a first width and the bottom region has a second width. The second width is greater than the first width.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.