Method for manufacturing printed circuit boards
US9648720B2 · kind B2 · utility
0Cited by
65References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 22, 2013 |
| Grant date | May 9, 2017 |
| Priority date | — |
| Expiry date | Sep 18, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1383
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method including: attaching a plurality of conductive tracks to at least one surface of a substrate, depositing a coating comprising at least one halo-hydrocarbon polymer on the at least one surface of the substrate, and soldering through the coating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.