Patent · US Active

Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment

US9649712B2 · kind B2 · utility

5Cited by

117References

30Claims

0Family size

Assignee

ENTEGRIS, INC. · US

Inventors

Tianniu Chen · Westford, US
Michael B. Korzenski · Danbury, US
Ping Jiang · Clemson, US

Key dates

Filing date	Jul 20, 2015
Grant date	May 16, 2017
Priority date	—
Expiry date	Jul 20, 2035

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P70/50
WIPO fieldMaterials, metallurgy
WIPO sectorChemistry

Abstract

Apparatuses and processes for recycling printed wire boards, wherein electronic components, precious metals and base metals may be collected for reuse and recycling. The apparatuses generally include a mechanical solder removal module and/or a thermal module, a chemical solder removal module, and a precious metal leaching module, wherein the modules are attached for continuous passage of the e-waste from module to module.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.