Paste and process for forming a solderable polyimide-based polymer thick film conductor
US9649730B2 · kind B2 · utility
0Cited by
4References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 12, 2015 |
| Grant date | May 16, 2017 |
| Priority date | — |
| Expiry date | Dec 8, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0245
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention is directed to a paste composition and a process for forming a solderable polyimide-based polymer thick film conductor. The paste composition comprising an electrically conductive metal, a polyimide, an organosilicon compound and an organic solvent and can be cured by heating at a temperature of 320 to 380° C. The invention also provides an electrical device containing a solderable polyimide-based polymer thick film conductor formed using the paste composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.