Method for electroless plating of palladium phosphorus directly on copper, and a plated component therefrom
US9650719B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 2, 2017 |
| Grant date | May 16, 2017 |
| Priority date | — |
| Expiry date | Feb 2, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0338
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A solution comprising a palladium compound and a polyaminocarboxylic compound has been found to be suitable as a bath for electroless plating of palladium onto copper. Use of such a solution produces a plated component comprising a copper surface and a palladium plated coating having a thickness of between 0.01 micrometers (μm) and 5 μm. A method for electroless plating of palladium onto a copper surface of a component includes preparing a bath having a palladium compound and a polyaminocarboxylic compound. The copper component is submerged in the bath to plate a palladium layer on the copper surface of the component. The component resulting from the plating method has a palladium layer plated on the copper surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.