Jon Bengston
10Patents
5h-index
9Co-inventors
59Inventor score
Filing activity: Sep 12, 1990 → Feb 2, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5235139A | Method for fabricating printed circuits | Emerging Cross-Sectional Technologies | 295 | Expired |
| US5147692A | Electroless plating of nickel onto surfaces such as copper or fused tungston | Electricity | 256 | Expired |
| US6281090A | Method for the manufacture of printed circuit boards with plated resistors | Electricity | 34 | Expired |
| US5474798A | Method for the manufacture of printed circuit boards | Electricity | 17 | Expired |
| US5431959A | Process for the activation of nickel - phosphorous surfaces | Chemistry; Metallurgy | 6 | Expired |
| US5431739A | Process for cleaning and defluxing parts, specifically electronic circuit assemblies | Electricity | 5 | Expired |
| US6692583B2 | Magnesium conversion coating composition and method of using same | Chemistry; Metallurgy | 4 | Expired |
| US6837923B2 | Polytetrafluoroethylene dispersion for electroless nickel plating applications | Chemistry; Metallurgy | 4 | Expired |
| US9650719B1 | Method for electroless plating of palladium phosphorus directly on copper, and a plated component therefrom | Electricity | 0 | Active |
| US9603258B2 | Composition and method for electroless plating of palladium phosphorus on copper, and a coated component therefrom | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.