Semiconductor package and method of estimating surface temperature of semiconductor device including the same
US9651431B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2013 |
| Grant date | May 16, 2017 |
| Priority date | — |
| Expiry date | Sep 25, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A semiconductor package includes a first package including a first substrate and a first semiconductor chip mounted on the first substrate and a second package facing and spaced apart from the first package. The second package includes a second substrate on which a second semiconductor chip is mounted. The semiconductor package also includes a connection structure electrically connecting the first and second packages to each other, a first temperature sensor connected to the first substrate, a second temperature sensor connected to the first semiconductor chip, and a third temperature sensor connected to the second semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.