Sublayers for magnetically soft underlayer
US9653105B2 · kind B2 · utility
0Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 14, 2010 |
| Grant date | May 16, 2017 |
| Priority date | — |
| Expiry date | Sep 4, 2032 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/568
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of forming a uniform thickness layer of a selected material on a surface of a substrate comprises steps of:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.