Plasma processing apparatus and method
US9653334B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 19, 2015 |
| Grant date | May 16, 2017 |
| Priority date | — |
| Expiry date | May 19, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6831
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A plasma processing apparatus includes a processing chamber, a plasma source that generates plasma within the processing chamber, a transfer carrier that has a holding sheet and a frame, the holding sheet holding a substrate, and the frame being attached to the holding sheet so as to surround the substrate, a stage that is provided within the processing chamber and has a gas supply hole formed in a mounting area of the stage for mounting the transfer carrier thereon, an electrostatic chucking part that is provided within the stage and electrostatically attracts the transfer carrier, and a gas supply part that supplies gas through the gas supply hole of the stage to assist separation of the transfer carrier from the stage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.