Integrated shielding for wafer plating
US9653339B2 · kind B2 · utility
1Cited by
13References
27Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 16, 2011 |
| Grant date | May 16, 2017 |
| Priority date | — |
| Expiry date | Oct 31, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68764
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A semiconductor substrate carrier for use during wet chemical processing may comprise a conductive flange to couple the carrier with processing equipment, a frame coupled with the conductive flange, where the frame is configured to hold a semiconductor substrate, and an integrated shield coupled with the frame. The integrated shield is configured to alter an electric field near at least a portion of a surface of the semiconductor substrate during the wet chemical processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.