Patent · US Active

Methods including a processing of wafers and spin coating tool

US9653367B2 · kind B2 · utility

2Cited by

0References

8Claims

0Family size

Assignee

GlobalFoundries Inc. · KY

Inventors

Torsten Maehr · Dresden, DE
Martin Freitag · Munich, DE
Arthur Hotzel · Dresden, DE

Key dates

Filing date	Jun 29, 2015
Grant date	May 16, 2017
Priority date	—
Expiry date	Jun 29, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01L22/20
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method includes performing a spin coating process. In the spin coating process, a first fluid is dispensed to a surface of a wafer. The method further includes performing an inspection of an edge area of the wafer. On the basis of the inspection of the edge area of the wafer, a defect analysis is performed. In the defect analysis, it is determined if the edge area of the wafer has a defect that is indicative of an insufficient coating of the surface of the wafer by the first fluid.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.