Semiconductor package including heat spreader and method for manufacturing the same
US9653373B2 · kind B2 · utility
3Cited by
4References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2015 |
| Grant date | May 16, 2017 |
| Priority date | — |
| Expiry date | Dec 21, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes a semiconductor chip on a package substrate, a heat spreader on the semiconductor chip, a molding layer, an adhesive film between the semiconductor chip and the heat spreader, and a through-hole passing through the heat spreader. The heat spreader includes a first surface and a second surface. The molding layer covers sidewalls of the semiconductor chip and the heat spreader and exposes the first surface of the heat spreader. The adhesive film is on the second surface of the heat spreader.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.