Electronic package that includes fine powder coating
US9653411B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2015 |
| Grant date | May 16, 2017 |
| Priority date | — |
| Expiry date | Dec 18, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/37001
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic package that includes a substrate; an electronic component mounted to a surface of the substrate; and a porous coating that includes grains of metal powder formed onto the electronic component by melting the metal powder onto the electronic component. An electronic package that includes a substrate; an electronic component mounted to a surface of the substrate; and a porous coating that includes grains of metal powder formed onto the substrate by melting the metal powder onto the substrate. An electronic package that includes a substrate; an electronic component mounted to a surface of the substrate; an initial mold covering the electronic component; and a porous coating that includes grains of metal powder formed onto the initial mold by melting the metal powder onto the initial mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.