Semiconductor package and fabricating method thereof
US9653428B1 · kind B1 · utility
200Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 11, 2016 |
| Grant date | May 16, 2017 |
| Priority date | — |
| Expiry date | Jul 11, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18162
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package structure and a method for making a semiconductor package. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a connect die that routes electrical signals between a plurality of other semiconductor die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.