Thermal performance structure for semiconductor packages and method of forming same
US9653443B2 · kind B2 · utility
9Cited by
80References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 14, 2014 |
| Grant date | May 16, 2017 |
| Priority date | — |
| Expiry date | Apr 11, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18162
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An embodiment device includes a first die, a second die electrically connected to the first die, and a heat dissipation surface on a surface of the second die. The device further includes a package substrate electrically connected to the first die. The package substrate includes a through-hole, and the second die is at least partially disposed in the through hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.