LED packages and related methods

US9653656B2 · kind B2 · utility

Assignee

• ADVANCED SEMICONDUCTOR ENGINEERING, INC. · TW

Inventor

• Hsun-Wei Chan

Key dates

• Filing date: Mar 16, 2012
• Grant date: May 16, 2017
• Expiry date: Oct 3, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/49113

Abstract

An LED package with trenches traversing a die pad to provide a mechanical interlock mechanism to strengthen bonding between the die pad and an insulator such that de-lamination is less likely to occur between the die pad and the insulator. A chip carrying region is defined by a barrier portion formed by the insulator in the trenches and in gaps between electrodes and the die pad, such that a light converting layer is confined within the barrier portion.