Patent · US Active

Method for producing an optoelectronic semiconductor component, and optoelectronic semiconductor component

US9653670B2 · kind B2 · utility

4Cited by

2References

20Claims

0Family size

Assignee

OSRAM Opto Semiconductors GmbH · DE

Inventors

Stefan Illek · Donaustauf, DE
Walter Wegleiter · Nittendorf, DE
Karl Weidner · Birkenfeld, DE
Stefan Stegmeier · Munich, DE

Key dates

Filing date	Jan 17, 2013
Grant date	May 16, 2017
Priority date	—
Expiry date	Apr 27, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/8585
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

In at least one embodiment, the semiconductor component includes at least one optoelectronic semiconductor chip having a radiation exit side. The surface-mountable semiconductor component comprises a shaped body that covers side surfaces of the semiconductor chip directly and in a positively locking manner. The shaped body and the semiconductor chip do not overlap, as seen in a plan view of the radiation exit side.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.