Apparatus for treating surfaces of wafer-shaped articles
US9657397B2 · kind B2 · utility
0Cited by
20References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 31, 2013 |
| Grant date | May 23, 2017 |
| Priority date | — |
| Expiry date | Apr 13, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68792
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An apparatus for processing wafer-shaped articles comprises a closed process chamber providing a gas-tight enclosure. A rotary chuck is located within the closed process chamber, the rotary chuck being adapted to hold a wafer shaped article thereon. A lid is secured to an upper part of the closed process chamber, the lid comprising an upper plate formed from a composite fiber-reinforced material and a lower plate that faces into the process chamber and is formed from a chemically-resistant plastic.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.