Optical element
US9658542B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 7, 2014 |
| Grant date | May 23, 2017 |
| Priority date | — |
| Expiry date | Apr 24, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70825
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The disclosure relates to an optical assembly for a projection exposure apparatus for semiconductor lithography. The optical assembly includes at least one optical element and a mounting body for mechanically fixing the element in a supporting structure. The optical assembly also includes at least one cooling body for dissipating heat from the element. The mounting body and the cooling body are separate from one another. The optical element is connected to the cooling body via at least one heat-conducting element. The disclosure also relates to a projection exposure apparatus including an optical assembly according to the disclosure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.