Shielding device for substrate edge protection and method of using same
US9659677B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2014 |
| Grant date | May 23, 2017 |
| Priority date | — |
| Expiry date | Nov 7, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F71/00
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A shielding device for shielding an edge of a semiconductor substrate can include a multisided frame defining a perimeter of an enclosed area, and a shield coupled to the frame. The shield may be configured to move between a first position where the shield is retracted to the perimeter and a second position where shield advanced into the enclosed area. A method for processing a semiconductor substrate includes placing a semiconductor substrate in position in an implantation chamber, covering edges of the semiconductor substrate by pushing shields into engagement with the edges, performing an ion implantation procedure, and retracting the shields from the edges.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.