Fan-out interconnect structure and methods forming the same
US9659805B2 · kind B2 · utility
15Cited by
12References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 17, 2015 |
| Grant date | May 23, 2017 |
| Priority date | — |
| Expiry date | Apr 17, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/92244
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method includes forming an adhesive layer over a carrier, forming a sacrificial layer over the adhesive layer, forming through-vias over the sacrificial layer, and placing a device die over the sacrificial layer. The Method further includes molding and planarizing the device die and the through-vias, de-bonding the carrier by removing the adhesive layer, and removing the sacrificial layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.