System, method, and computer program product for a cavity package-on-package structure
US9659815B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 23, 2014 |
| Grant date | May 23, 2017 |
| Priority date | — |
| Expiry date | May 25, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system, method, and computer program product are provided for producing a cavity bottom package of a package-on-package structure. The method includes the steps of receiving a bottom package comprising a substrate material having a top layer including a first set of pads configured to be electrically coupled to a second set of pads of an integrated circuit die. A layer of non-conductive material is applied to the top layer of the bottom package and a cavity is formed in the layer of non-conductive material to expose the first set of pads, where the cavity is configured to contain the integrated circuit die oriented such that the second set of pads face the first set of pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.