Method and apparatus for improving the reliability of a connection to a via in a substrate
US9659851B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 3, 2015 |
| Grant date | May 23, 2017 |
| Priority date | — |
| Expiry date | Jul 12, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Some of the embodiments of the present disclosure provide a semiconductor package interposer comprising a substrate having a first surface and a second surface, a plurality of vias extending between the first surface and the second surface of the substrate, the plurality of vias electrically connecting electrical connectors or circuitry on the first surface of the substrate to electrical connectors or circuitry on the second surface of the substrate, and metal plugs at least partially filling the plurality of vias. At least one of (i) the first surface or (ii) the second surface of the substrate includes depressions at distal ends of the metal plugs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.