Double side mounting memory integration in thin low warpage fanout package
US9659907B2 · kind B2 · utility
14Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 7, 2015 |
| Grant date | May 23, 2017 |
| Priority date | — |
| Expiry date | Apr 7, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Packages and methods of formation are described. In an embodiment, a package includes a redistribution layer (RDL) formed directly on a top die, and a bottom die mounted on a back surface of the RDL.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.