High-yield fabrication of large-format substrates with distributed, independent control elements
US9660008B2 · kind B2 · utility
5Cited by
6References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 9, 2015 |
| Grant date | May 23, 2017 |
| Priority date | — |
| Expiry date | Sep 9, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/1201
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A large-format substrate with distributed control elements is formed by providing a substrate and a wafer, the wafer having a plurality of separate, independent chiplets formed thereon; imaging the wafer and analyzing the wafer image to determine which of the chiplets are defective; removing the defective chiplet(s) from the wafer leaving remaining chiplets in place on the wafer; printing the remaining chiplet(s) onto the substrate forming empty chiplet location(s); and printing additional chiplet(s) from the same or a different wafer into the empty chiplet location(s).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.