System and a method for solder mask inspection
US9661755B2 · kind B2 · utility
6Cited by
9References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 10, 2012 |
| Grant date | May 23, 2017 |
| Priority date | — |
| Expiry date | Jan 12, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/163
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A system and a method for inspection aided printing, the method may include printing, by a printing unit of a system, a pattern on an area of a substrate, during a printing process; inspecting, by an inspection unit of the system, the area to provide inspection results; searching, by a processor of the system, for a defect, based upon the inspection results; and wherein if a defect is found—determining whether to (a) repair the substrate, (b) perform a corrective measure for improving the printing process, or (c) perform no corrective measure in response to the defect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.