Structure containing conductor circuit, method for manufacturing same, and heat-curable resin composition
US9661763B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 9, 2012 |
| Grant date | May 23, 2017 |
| Priority date | — |
| Expiry date | Dec 14, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49162
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a structure containing a conductor circuit according to the present invention can provide openings in various shapes by patterning a first photosensitive resin layer in a first patterning process according to shapes of openings formed in a heat-curable resin layer. Further, in the method for manufacturing a structure containing a conductor circuit, a plurality of openings can be formed at the same time and a residue of the resin around the opening can be reduced, unlike a case in which openings are formed with a laser. Therefore, it is possible to sufficiently efficiently manufacture the structure having excellent reliability even when the number of pins of a semiconductor element increases and it is necessary to provide a great number of fine openings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.