Multi-component electronic module with integral coolant-cooling

US9661784B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Amilcar R. Arvelo · Poughkeepsie, US
• Levi A. Campbell · Poughkeepsie, US
• Michael J. Ellsworth, Jr. · Poughkeepsie, US
• Eric J. McKeever · Poughkeepsie, US

Key dates

• Filing date: Oct 28, 2015
• Grant date: May 23, 2017
• Expiry date: Nov 18, 2035

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A coolant-cooled electronic module is provided which includes a multi-component assembly and a module lid with openings aligned over respective electronic components. Thermally conductive elements are disposed within the openings, each including opposite coolant-cooled and conduction surfaces, with the conduction surface being thermally coupled to the respective electronic component. A manifold assembly disposed over the module lid includes inner and outer manifold elements, with the inner element configured to facilitate flow of coolant onto the coolant-cooled surfaces. The outer manifold element is disposed over the inner manifold element and coupled to the module lid, with the inner and outer manifold elements defining a coolant supply manifold, and the outer manifold element and module lid defining a coolant return manifold. The coolant supply openings are in fluid communication with the coolant supply manifold, and the coolant exhaust channels are in fluid communication with the coolant return manifold.