Method for slicing wafers from a workpiece by means of a wire saw
US9662804B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 2, 2014 |
| Grant date | May 30, 2017 |
| Priority date | — |
| Expiry date | Feb 9, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB28D5/045
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for sawing a multiplicity of wafers from a workpiece by means of a wire web of a wire saw includes providing a wire web consisting of a plurality of parallel wire sections. The wire web is spanned by at least two wire guide rollers where each wire guide rollers comprises a core having two side surfaces and a lateral surface. The core is composed of a first material. Each core is rotatably mounted along its longitudinal axis and comprises at least two separate cavities. The lateral surface of each core is enclosed by a jacket composed of a second material. Parallel groves are cut into the jacket for guiding the wire sections of the web. The length of the jacket is altered thermally by means of at least one cavity being filled with a temperature regulating medium.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.