Methods for molding integrated circuits
US9662812B2 · kind B2 · utility
1Cited by
17References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 31, 2012 |
| Grant date | May 30, 2017 |
| Priority date | — |
| Expiry date | Dec 19, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/157
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method includes molding a polymer onto a package component. The step of molding includes a first molding stage performed at a first temperature, and a second molding stage performed at a second temperature different from the first temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.