Patent · US Active

Method for producing a wafer equipped with transparent plates

US9663351B2 · kind B2 · utility

1Cited by

2References

8Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Simon Armbruster · Wannweil, DE
Dietmar Haberer · Reutlingen, DE
Stefan Pinter · Reutlingen, DE
Jochen Tomaschko · Herrenberg, DE
Benjamin Steuer · Waldenbuch, DE

Key dates

Filing date	Jan 30, 2015
Grant date	May 30, 2017
Priority date	—
Expiry date	Jul 3, 2035

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/24331
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

A production method for a wafer equipped with transparent plates includes: formation of a row of through-holes in a wafer; formation of at least one strip-shaped recess in a wafer surface, each of the through-holes of the same row intersecting partly with the respectively associated strip-shaped recess; an uninterrupted groove being formed in each intermediate region between two adjacent through-holes of the same row, the floor surface of the groove being oriented so as to be inclined relative to the wafer surface by an angle of inclination greater than 0° and less than 90°; and covering at least one through-hole with at least one transparent plate made of at least one material transparent to at least a sub-spectrum of electromagnetic radiation.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.