Suspensions for protecting semiconductor materials and methods of producing semiconductor bodies
US9663699B2 · kind B2 · utility
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7Claims
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Key dates
| Filing date | Feb 25, 2016 |
| Grant date | May 30, 2017 |
| Priority date | — |
| Expiry date | Feb 25, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/01
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A suspension for protecting a semiconductor material, comprising a carrier medium, trimethylolpropane as a plasticizer, benzotriazole derivate as an absorber dye, and inorganic particles selected from the group consisting of aluminum nitride, silicon nitride and boron nitride, wherein the thermal conductivity of the suspension is about 1 W/mk to about 2 W/mk.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.