Laser microdissection method and laser microdissection device
US9664599B2 · kind B2 · utility
2Cited by
6References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 21, 2012 |
| Grant date | May 30, 2017 |
| Priority date | — |
| Expiry date | Aug 28, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05B2219/45041
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Methods and apparatuses for laser microdissection are provided. For example, by a user at least one first system parameter is adjusted, for example varied, and at least one second system parameter of the laser microdissection system is adjusted automatically by the laser microdissection system such that a cut line has a desired cut line parameter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.