Semiconductor device
US9666239B2 · kind B2 · utility
2Cited by
0References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 2, 2015 |
| Grant date | May 30, 2017 |
| Priority date | — |
| Expiry date | May 13, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D89/10
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
According to an embodiment, a semiconductor device includes a plurality of wiring patterns of wiring lines disposed in parallel in a line-and-space pattern in a predetermined pitch and extend in a first direction in a first region, first bending patterns that extend pairs of the wiring lines in a second in a second region adjacent to the first region, second bending patterns extend the pairs of wiring lines in opposite directions along the orientation of the first direction in the second region, and dummy patterns separated from the two second bending patterns at a predetermined distance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.