Methods and apparatus for uniformly metallization on substrates
US9666426B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 24, 2011 |
| Grant date | May 30, 2017 |
| Priority date | — |
| Expiry date | Feb 21, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67138
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus for substrate metallization from electrolyte is provided. The apparatus comprises: an immersion cell containing metal salt electrolyte; at least one electrode connecting to at least one power supply; an electrically conductive substrate holder holding at least one substrate to expose a conductive side of the substrate to face the at least one electrode; an oscillating actuator for oscillating the substrate holder with an amplitude and a frequency; at least one ultrasonic device with an operating frequency and an intensity, disposed in the metallization apparatus; at least one ultrasonic power generator connecting to the ultrasonic device; at least one inlet for metal slat electrolyte feeding; and at least one outlet for metal salt electrolyte draining.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.