Methods for solder for through-mold interconnect
US9666549B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 9, 2015 |
| Grant date | May 30, 2017 |
| Priority date | — |
| Expiry date | Oct 9, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Generally discussed herein are systems and apparatuses that include an extended TSBA ball and techniques for making the same. According to an example, a technique can include forming a circuit substrate including forming a circuit on a substrate, the circuit exposed along an upper surface of the substrate, wherein the substrate is for coupling the circuit with a die along a lower surface of the circuit substrate. A molding can be formed onto an upper surface of the circuit substrate, over the circuit of the circuit substrate. An opening can be defined in the molding so that the opening can extend to a top surface of the molding to at least a portion of the circuit. Solder can be formed into the opening, including conforming the solder to the opening and the circuit substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.