Patent · US Active

Millimeter wave integrated circuit with ball grid array package including transmit and receive channels

US9666553B2 · kind B2 · utility

1Cited by

4References

20Claims

0Family size

Assignee

TEXAS INSTRUMENTS INCORPORATED · US

Inventors

Rajen Manicon Murugan · Garland, US
Minhong Mi · Dorpsstraat, US
Gary P. Morrison · Garland, US
Jie Chen · New Taipei, TW
Kenneth Robert Rhyner · Rockwall, US
Stanley Craig Beddingfield · McKinney, US
Chittranjan Mohan Gupta · Richardson, US
Django Trombley · Dallas, US

Key dates

Filing date	Jun 15, 2015
Grant date	May 30, 2017
Priority date	—
Expiry date	Jul 17, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/10734
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A millimeter wave integrated circuit (IC) chip. The IC chip comprises an IC die and a wire bond ball grid array package encapsulating the IC die. The wire bond ball grid array package comprises a solder ball array, a millimeter wave transmit channel, and a millimeter wave receive channel, wherein each millimeter wave transmit and receive channel electrically couples the IC die to a signal ball of the solder ball array and is configured to resonate at an operating frequency band of the millimeter wave IC chip.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.