Thermoelectric cooling packages and thermal management methods thereof
US9671141B2 · kind B2 · utility
7Cited by
15References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 7, 2015 |
| Grant date | Jun 6, 2017 |
| Priority date | — |
| Expiry date | Dec 7, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12044
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device includes a first board having a first area and a second area not overlapping the first area; and a thermoelectric semiconductor disposed between the first board and the second board at the first area of the first board configured to supply a voltage to the thermoelectric semiconductor; a package disposed at the second area of the first board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.