Detection of foreign material on a substrate chuck
US9671323B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 6, 2015 |
| Grant date | Jun 6, 2017 |
| Priority date | — |
| Expiry date | Dec 12, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67288
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and apparatus for determining the presence of foreign material on a substrate chuck. The method includes: placing a bottom surface of a substrate on a top surface of the substrate chuck; applying a lateral force in a direction parallel to a top surface of the substrate chuck to the substrate; when the substrate moves partially off or moves completely off the substrate chuck in response to the applying the lateral force then a defect is present between the top surface of the substrate chuck and the bottom surface of the substrate; or when the substrate remains completely on the substrate chuck in response to the applying the lateral force then a defect is not present between the top surface of the substrate chuck and the bottom surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.