Patent · US Active

Discrete electronic device embedded in chip module

US9673179B1 · kind B1 · utility

4Cited by

8References

20Claims

0Family size

Assignee

International Business Machines Corporation · US

Inventors

Andreas Huber · Holzgerlingen, DE
Harald Huels · Eppelheim, DE
Stefano S. Oggioni · Cantù, IT
Thomas Strach · Wildberg, DE
Thomas-Michael Winkel · Eppelheim, DE

Key dates

Filing date	Jul 20, 2016
Grant date	Jun 6, 2017
Priority date	—
Expiry date	Jul 20, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/10106
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

The invention relates to a method for embedding a discrete electronic device in a chip module. The chip module comprises a multilayer substrate which comprises a plurality of electrically conductive layers stacked above each other and an electrically non-conductive layer arranged between each pair of electrically conductive layers. The chip module is configured to receive one or more chips to be mounted onto a top surface thereof. Each electrically conductive layer comprises one or more electrically conductive structures. A recess is provided in a side surface of the chip module. The discrete electronic device is inserted into the recess. A first electrically conductive connection between a first electrical contact of the discrete electronic device and a first electrically conductive structure is established. Further, a second electrically conductive connection between a second electrical contact of the discrete electronic device and a second electrically conductive structure is established.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.