Methods for forming a cobalt-ruthenium liner layer for interconnect structures
US9677172B2 · kind B2 · utility
5Cited by
0References
11Claims
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Assignee
Inventors
Key dates
| Filing date | Jan 21, 2015 |
| Grant date | Jun 13, 2017 |
| Priority date | — |
| Expiry date | Jan 21, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/53238
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Methods for forming a liner layer are provided herein. In some embodiments, a method of forming a liner layer on a substrate disposed in a process chamber, the substrate having an opening formed in a first surface of the substrate, the opening having a sidewall and a bottom surface, the method includes exposing the substrate to a cobalt precursor gas and to a ruthenium precursor gas to form a cobalt-ruthenium liner layer on the first surface of the substrate and on the sidewall and bottom surface of the opening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.