Substrate inspection apparatus
US9678107B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2015 |
| Grant date | Jun 13, 2017 |
| Priority date | — |
| Expiry date | Apr 3, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2889
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
There is provided a substrate inspection apparatus in which a contact between a probe and a semiconductor device is checked without using an IC tester. Further, when an abnormal state is detected in the contact check, a cause of the abnormal state can be determined. A prober includes a probe card having a plurality of probes to be contacted with respective electrode pads of the semiconductor device formed on a wafer W. The probe card includes a card-side inspection circuit configured to reproduce a circuit configuration of DRAM in which the semiconductor device cut from the wafer W is to be mounted, and a comparator configured to measure a potential of a line between the probe and the card-side inspection circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.