Packaged opto-electronic module

US9678271B2 · kind B2 · utility

Assignee

• Oracle International Corporation · US

Inventors

• Hiren D. Thacker · San Diego, US
• Ashok V. Krishnamoorthy · San Diego, US
• Xuezhe Zheng · San Diego, US
• John E. Cunningham · San Diego, US

Key dates

• Filing date: Jan 26, 2015
• Grant date: Jun 13, 2017
• Expiry date: Nov 25, 2035

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/15311
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are proximate to each other in the chip package. The integrated circuit includes electrical circuits that modulate data, communicate data, and serialize/deserialize data, and the optical integrated circuit communicates optical signals with very high bandwidth. Moreover, a front surface of the integrated circuit is electrically coupled to a top surface of an interposer, and a top surface of the integrated circuit is electrically coupled to a front surface of the optical integrated circuit. Furthermore, a bottom surface of the optical integrated circuit faces the top surface of the interposer, and the front surface of the optical integrated circuit is optically coupled to an optical-fiber receptacle, which in turn is optically coupled to an optical-fiber connector.