Finger biometric sensor assembly including direct bonding interface and related methods
US9679187B2 · kind B2 · utility
3Cited by
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26Claims
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Key dates
| Filing date | Jun 17, 2015 |
| Grant date | Jun 13, 2017 |
| Priority date | — |
| Expiry date | Jan 28, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06V40/1329
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A finger biometric sensor assembly may include a finger biometric sensor integrated circuit (IC) die having a finger sensing area and a cover layer aligned with the finger sensing area. The finger biometric sensor may also include a direct bonding interface between the finger biometric sensor and the cover layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.