Substrate conveyance apparatus and substrate peeling system
US9679798B2 · kind B2 · utility
0Cited by
5References
10Claims
0Family size
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Key dates
| Filing date | Feb 18, 2014 |
| Grant date | Jun 13, 2017 |
| Priority date | — |
| Expiry date | Dec 16, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S156/941
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Disclosed is a substrate conveyance apparatus capable of suppressing a substrate from being damaged. The substrate conveyance apparatus includes a plurality of nozzles, and a main body unit. The plurality of nozzles are configured to jet a gas toward a surface of a substrate to hold the substrate in a non-contact manner. The main body unit is provided with the plurality of nozzles. At least surfaces of the plurality of nozzles are formed of a resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.